US 12,178,143 B2
Superconducting complex quantum computing circuit
Yasunobu Nakamura, Tokyo (JP); Yutaka Tabuchi, Wako (JP); and Shuhei Tamate, Tokyo (JP)
Assigned to JAPAN SCIENCE AND TECHNOLOGY AGENCY, Saitama (JP)
Filed by JAPAN SCIENCE AND TECHNOLOGY AGENCY, Kawaguchi (JP)
Filed on Jul. 21, 2023, as Appl. No. 18/224,685.
Application 18/224,685 is a division of application No. 17/283,037, granted, now 11,758,829, previously published as PCT/IB2019/059335, filed on Oct. 31, 2019.
Prior Publication US 2023/0380303 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H10N 69/00 (2023.01); G06N 10/00 (2022.01); H10N 60/12 (2023.01); H10N 60/80 (2023.01)
CPC H10N 69/00 (2023.02) [G06N 10/00 (2019.01); H10N 60/12 (2023.02); H10N 60/805 (2023.02)] 5 Claims
OG exemplary drawing
 
1. A superconducting quantum computing circuit, comprising:
a circuit substrate having a first surface, a second surface which is an opposite surface of the first surface, and a plurality of through-substrate electrodes;
a wiring pattern of a circuit element, and a first ground pattern formed on the first surface, wherein the circuit element includes a plurality of superconducting qubits and measurement electrodes for observing the state of the plurality of superconducting qubits;
a second ground pattern formed on the second surface of the circuit substrate;
a control signal line for providing a control signal, wherein the control signal line is in contact with the circuit substrate from a directoin perpendicular to the circuit substrate, corresponding to the position of the superconducting qubit;
a first ground electrode facing the first surface of the circuit substrate and having a first contact portion which is in contact with the first ground pattern formed on the first surface of the circuit substrate,
a first non-contact portion, facing the first surface of the circuit substrate, which is not contact with the first surface of the circuit substrate,
wherein the control signal line is arranged in the first non-contact portion; and
wherein the plurality of through-substrate electrodes connect the first ground pattern and the second ground pattern.