US 12,178,019 B2
Coolant system for a busbar assembly
Brian Patrick Costello, Scotts Valley, CA (US); and Jie Luo, Foshan (CN)
Assigned to TE CONNECTIVITY SOLUTIONS GMBH ET AL, Schaffhausen (CH)
Filed by TE Connectivity Services GmbH, Schaffhausen (CH); and Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN)
Filed on Dec. 21, 2021, as Appl. No. 17/557,112.
Claims priority of application No. 202111469544.9 (CN), filed on Dec. 3, 2021.
Prior Publication US 2023/0180443 A1, Jun. 8, 2023
Int. Cl. H05K 7/20 (2006.01); H01R 13/533 (2006.01); H02B 1/20 (2006.01)
CPC H05K 7/20781 (2013.01) [H01R 13/533 (2013.01); H02B 1/20 (2013.01); H05K 7/20945 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A busbar assembly comprising:
a first busbar having a mating interface for mating with an electrical component to provide a power supply path for the electrical component;
a second busbar having a mating interface for mating with the electrical component to provide a power return path for the electrical component;
an isolator panel positioned between the first busbar and the second busbar, the isolator panel supporting the first busbar at a first side thereof, the isolator panel supporting the second busbar at a second side thereof, wherein the first and second busbars and the isolator panel extend along parallel paths through the busbar assembly in a busbar stack;
a first thermal conduit extending along the first busbar, the first thermal conduit allowing liquid coolant to flow therethrough to dissipate heat from the first busbar; and
a second thermal conduit extending along the second busbar, the second thermal conduit allowing liquid coolant to flow therethrough to dissipate heat from the second busbar.