US 12,178,018 B2
Back cover heat dissipation structure of laptop
Yin-Cheng Tsai, Taipei (TW)
Assigned to Getac Technology Corporation, New Taipei (TW)
Filed by GETAC TECHNOLOGY CORPORATION, New Taipei (TW)
Filed on Jan. 13, 2023, as Appl. No. 18/097,158.
Claims priority of provisional application 63/351,425, filed on Jun. 12, 2022.
Prior Publication US 2023/0400898 A1, Dec. 14, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); G06K 19/07 (2006.01); H01Q 1/02 (2006.01); H04B 1/00 (2006.01); H04B 1/16 (2006.01); H04B 5/72 (2024.01); H04B 5/73 (2024.01); H05K 1/02 (2006.01)
CPC H05K 7/20481 (2013.01) [G06F 1/203 (2013.01); G06K 19/0723 (2013.01); H01Q 1/02 (2013.01); H04B 1/0057 (2013.01); H04B 1/16 (2013.01); H04B 5/72 (2024.01); H04B 5/73 (2024.01); H05K 1/0203 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A back cover heat dissipation structure of a laptop, comprising:
a radio frequency tag module comprising a circuit board with a component region and an antenna region, wherein the component region and the antenna region are disposed on a bottom side and a top side of the circuit board, respectively;
a back cover comprising a plating region and a receiving chamber, wherein the receiving chamber receives the radio frequency tag module, and the top side of the circuit board is attached to a bottom of the receiving chamber; and
a metal foil covering the bottom side of the circuit board and extending to cover the plating region.