US 12,178,010 B2
Additive manufacturing compatible liquid-cooled PCB chassis
Richard E. Berkenbush, Pompton Plains, NJ (US); Robert E. Scholl, Morristown, NJ (US); Meredith T. Thanos, Morris Plains, NJ (US); and Robert S. Foster, Wharton, NJ (US)
Assigned to BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US)
Filed by BAE SYSTEMS Information and Electronic Systems Integration Inc., Nashua, NH (US)
Filed on May 10, 2023, as Appl. No. 18/195,538.
Prior Publication US 2024/0381565 A1, Nov. 14, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 5/00 (2006.01); H05K 7/18 (2006.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01)
CPC H05K 7/20254 (2013.01) [H05K 5/0039 (2013.01); H05K 5/0065 (2013.01); H05K 7/18 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12)] 20 Claims
OG exemplary drawing
 
1. A liquid cooled chassis suitable for supporting and cooling a plurality of printed circuit boards, the chassis comprising:
a plurality of metal chassis components including opposing, spaced apart, substantially horizontally parallel first and second chassis components, each of the first and second chassis components comprising a plurality of equally spaced, inwardly extending slot guides defining slots therebetween, at least some of the slots of the first chassis component being substantially vertically aligned with corresponding slots of the second chassis component, and being spaced apart therefrom so as to support vertical printed circuit boards inserted therebetween, while placing the slot guides that bound the slots into thermal communication with the inserted printed circuit boards;
first and second cooling channels formed respectively within the first and second chassis components in thermal communication with the slot guides, the cooling channels being configured to permit a cooling liquid to flow horizontally therethrough, and thereby to extract heat from the printed circuit boards, each of the cooling channels being bridged by a plurality of closely spaced planar baffles extending parallel to a flow direction of the cooling channels and dividing each of the cooling channels into a plurality of parallel sub-channels, the planar baffles being integral and monolithic with the first and second chassis components, and being inclined from horizontal at an angle of between 20 degrees and 45 degrees, a spacing between the baffles being less than a width of the baffles;
vertical third and fourth chassis components included in the plurality of chassis components, the third and fourth chassis component being configured for attachment without application of heat to the horizontal first and second chassis components; and
a connecting channel formed in the third chassis component, the connecting channel being configured to convey the cooling liquid from the cooling channel of the first chassis component to the cooling channel of the second chassis component, the third chassis component being configured to form liquid-tight connections between the connecting channel and the first and second cooling channels when the third chassis component is attached to the first and second chassis components.