US 12,178,008 B2
Cooling apparatus and cooling system
Takehito Tamaoka, Kyoto (JP); and Takahiro Imanishi, Kyoto (JP)
Assigned to NIDEC CORPORATION, Kyoto (JP)
Filed by Nidec Corporation, Kyoto (JP)
Filed on Jul. 5, 2022, as Appl. No. 17/857,200.
Claims priority of application No. 2021-112668 (JP), filed on Jul. 7, 2021.
Prior Publication US 2023/0008735 A1, Jan. 12, 2023
Int. Cl. H05K 7/00 (2006.01); H02K 5/22 (2006.01); H02K 11/33 (2016.01); H05K 7/20 (2006.01)
CPC H05K 7/20254 (2013.01) [H02K 5/225 (2013.01); H02K 11/33 (2016.01); H05K 7/20272 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A cooling apparatus comprising:
a cold plate made of a metal and in contact with a heat generating component;
a casing including an internal space defined therein and including a flow path along which a refrigerant flows, the flow path being located in the internal space;
a conductive component; and
a connection connecting a first end of the conductive component to the cold plate; wherein
the conductive component includes a second end connected to a ground;
the connection includes a fastening component with which the cold plate and the casing are fastened together; and
the fastening component includes an end which is spaced away from the cold plate in a direction in which the cold plate and the casing oppose one another.