US 12,177,996 B2
Sensor package structure
Li-Chun Hung, Hsin-Chu County (TW); Chien-Chen Lee, Hsin-Chu County (TW); and Chia-Shuai Chang, Hsin-Chu County (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed on Feb. 24, 2023, as Appl. No. 18/113,723.
Claims priority of provisional application 63/349,565, filed on Jun. 6, 2022.
Claims priority of application No. 111150521 (TW), filed on Dec. 29, 2022.
Prior Publication US 2023/0397354 A1, Dec. 7, 2023
Int. Cl. H05K 5/02 (2006.01); H01L 27/146 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01)
CPC H05K 5/0247 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H05K 5/0091 (2013.01); H05K 7/1417 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A sensor package structure, comprising:
a substrate;
a sensor chip disposed on the substrate, wherein a top surface of the sensor chip includes a sensing region and a carrying region that surrounds the sensing region;
a plurality of metal wires each having two ends respectively connected to the substrate and the carrying region of the sensor chip to electrically couple the substrate and the sensor chip;
a frame fixed on the substrate, wherein the sensor chip and the metal wires are located in a space surroundingly defined by the frame; and
a light-permeable layer having an outer surface and an inner surface that is opposite to the outer surface, wherein the light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment, and wherein the ring-shaped segment is disposed on the frame, so that the light-permeable layer, the frame, and the sensor chip jointly define an enclosed space;
wherein the ring-shaped segment has an inner ring-shaped roughened region, and wherein the inner ring-shaped roughened region is fixed to a top end surface of the frame, and an inner edge of the inner ring-shaped roughened region is located in the enclosed space.