US 12,176,829 B2
Micromechanical arm array in micro-electromechanical system (MEMS) actuators
Shih-Yu Liao, Hsinchu (TW); and Tsai-Hao Hung, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 3, 2023, as Appl. No. 18/365,204.
Application 18/365,204 is a continuation of application No. 17/833,827, filed on Jun. 6, 2022, granted, now 11,757,378.
Prior Publication US 2023/0396189 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H02N 1/00 (2006.01); B81B 5/00 (2006.01); B81B 7/00 (2006.01); H04N 23/68 (2023.01)
CPC H02N 1/006 (2013.01) [B81B 7/0016 (2013.01); B81B 2203/0136 (2013.01); H04N 23/687 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A micromechanical arm array comprising:
a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each of the plurality of micromechanical arms comprises a protrusion at a top of each of the plurality of micromechanical arms and protruding upwardly in a vertical direction; and
a metal connection structure extending in the first horizontal direction and comprising:
a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and
a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.