| CPC H01R 12/7047 (2013.01) [H01R 12/7064 (2013.01); H01R 12/714 (2013.01); H01R 12/716 (2013.01)] | 20 Claims |
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1. A circuit assembly comprising:
a flexible interconnect circuit comprising a first outer dielectric, a second outer dielectric, and a conductive element disposed between the first outer dielectric and the second outer dielectric;
a printed circuit board comprising a printed circuit board base and a printed circuit board conductive layer, wherein a portion of the conductive element of the flexible interconnect circuit extends past at least one or both of the first outer dielectric and the second outer dielectric of the flexible interconnect circuit and forms an electrical connection with the printed circuit board conductive layer; and
a conductor joining structure interconnecting the printed circuit board and the flexible interconnect circuit, wherein:
the conductor joining structure comprises a first portion and a second portion stacked with the first portion such that the first portion has a different material composition than the second portion,
the first portion directly interfaces and is welded to the conductive element of the flexible interconnect circuit, and
the second portion directly interfaces and is soldered to the printed circuit board conductive layer.
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