US 12,176,592 B2
High powered RF part for improved manufacturability
Michael Len, Skaneateles, NY (US); and Hans Peter Ostergaard, Viborg (DK)
Assigned to TTM Technologies Inc., Santa Ana, CA (US)
Filed by TTM TECHNOLOGIES INC., Santa Ana, CA (US)
Filed on Oct. 1, 2021, as Appl. No. 17/492,389.
Application 17/492,389 is a continuation of application No. 15/486,361, filed on Apr. 13, 2017, granted, now 11,158,920.
Claims priority of provisional application 62/338,281, filed on May 18, 2016.
Claims priority of provisional application 62/327,839, filed on Apr. 26, 2016.
Prior Publication US 2022/0029262 A1, Jan. 27, 2022
Int. Cl. H01P 1/30 (2006.01); H01P 5/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01)
CPC H01P 1/30 (2013.01) [H01P 5/187 (2013.01); H05K 1/0203 (2013.01); H05K 1/0243 (2013.01); H05K 1/0204 (2013.01); H05K 1/0215 (2013.01); H05K 1/0251 (2013.01); H05K 1/0306 (2013.01); H05K 3/3431 (2013.01); H05K 3/3442 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An electrical component for a printed circuit board, comprising:
a first dielectric layer having a top and a bottom;
a first conductive trace positioned on the bottom of the first dielectric layer;
a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace, wherein the first conductive trace is aligned with a second conductive trace of the printed circuit board along a full length of the first conductive trace;
a first solder layer connecting the first conductive trace to the second conductive trace of the printed circuit board and extending the full length of the first conductive trace; and
a third conductive trace over the top of the first dielectric layer, wherein the third conductive trace is electrically isolated or DC isolated from the first conductive trace, wherein the third conductive trace is coupled to signal outputs formed by two or more signal contact regions of the printed circuit board.