US 12,176,474 B2
Micro patterns created on the surface to control placement and uniformity of material with viscosity
Asako Toda, Santa Clara, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 17, 2020, as Appl. No. 17/125,505.
Prior Publication US 2022/0199881 A1, Jun. 23, 2022
Int. Cl. H01L 33/64 (2010.01); G02B 6/42 (2006.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01)
CPC H01L 33/642 (2013.01) [G02B 6/4251 (2013.01); G02B 6/4269 (2013.01); H01L 25/075 (2013.01); H01L 33/58 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An optical package, comprising:
a package substrate, wherein a channel is in the package substrate;
a compute die on the package substrate;
an optics die on the package substrate; and
an integrated heat spreader (IHS) over the compute die and the optics die, wherein channels are disposed on a surface of the IHS facing the package substrate.