US 12,176,463 B2
Semiconductor chip integrated device manufacturing method, semiconductor chip integrated device, semiconductor chip integrated device assembly, semiconductor chip ink, and semiconductor chip ink ejection device
Motonobu Takeya, Miyagi (JP)
Assigned to ULDTEC CO., LTD., Miyagi (JP)
Appl. No. 17/616,813
Filed by ULDTEC CO., LTD., Miyagi (JP)
PCT Filed Apr. 30, 2020, PCT No. PCT/JP2020/018221
§ 371(c)(1), (2) Date Dec. 6, 2021,
PCT Pub. No. WO2021/084783, PCT Pub. Date May 6, 2021.
Claims priority of application No. 2019-198092 (JP), filed on Oct. 31, 2019; and application No. 2020-017576 (JP), filed on Feb. 5, 2020.
Prior Publication US 2022/0310883 A1, Sep. 29, 2022
Int. Cl. H01L 33/40 (2010.01); H01L 21/66 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/40 (2013.01) [H01L 22/14 (2013.01); H01L 22/22 (2013.01); H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A micro LED display, comprising:
a mounting substrate having a lower electrode on one major surface,
a chip joining part formed by a part of an upper surface of the lower electrode or a bump formed on a part of the upper surface of the lower electrode in respective light emitting areas of respective pixels composing a micro LED display,
a plurality of micro LED chips joined to the chip joining part in random arrangement, each of the micro LED chips has a first electrode and a second electrode on an upper surface and a lower surface of the micro LED chip, respectively, and is configured such that the second electrode is more strongly attracted to a magnetic field than the first electrode, the second electrode containing ferromagnetic materials and the ferromagnetic materials being soft magnetic materials having properties that the soft magnetic materials are strongly magnetized by effect of a magnetic field and the soft magnetic materials have no magnetic force when a magnetic field does not exist,
wherein the first electrode is a p-side electrode and the second electrode is an n-side electrode or the first electrode is a n-side electrode and the second electrode is an p-side electrode; and
an upper electrode over the plurality of the micro LED chips having a main line part and a plurality of branch line parts branched from the main line part so as to straddle the chip joining part,
each of the plurality of the micro LED chips being joined to the chip joining part such that the second electrode faces and is electrically connected to the chip joining part, and the first electrode faces and is electrically connected to one of the plurality of the branch line parts of the upper electrode, and
wherein the micro LED display further comprises Zener diodes, each of the Zener diodes has a p-side electrode and an n-side electrode on the upper surface and the lower surface of the Zener diode, respectively, and is configured such that one of the p-side electrode side and the n-side electrode side is more strongly attracted to a magnetic field than the other, and the Zener diodes are connected so as to be reversely biased for the micro LED chips.