CPC H01L 29/4991 (2013.01) [H01L 21/0259 (2013.01); H01L 21/28123 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/4908 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/6656 (2013.01); H01L 29/66742 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a channel structure, extending along a first lateral direction, that is disposed over a substrate;
a gate structure, extending along a second lateral direction perpendicular to the first lateral direction, that straddles the channel structure;
an epitaxial structure, coupled to the channel structure, that is disposed next to the gate structure;
a first gate spacer and a second gate spacer each comprising a first portion disposed between the gate structure and the epitaxial structure along the first lateral direction; and
an air gap interposed between the first portion of the first gate spacer and the first portion of the second gate spacer;
wherein the air gap exposes a second portion of the first gate spacer that extends in the first lateral direction, wherein the second gate spacer further comprises a second portion that extends in the first lateral direction, and wherein the second portion of the first gate spacer and the second portion of the second gate spacer, disposed below the epitaxial structure, are in direct contact with each other.
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