CPC H01L 29/401 (2013.01) [H01L 21/28035 (2013.01); H01L 21/28088 (2013.01); H01L 21/823437 (2013.01); H01L 21/823462 (2013.01); H01L 21/823475 (2013.01); H01L 27/088 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/66545 (2013.01); H01L 29/66742 (2013.01); H01L 29/78645 (2013.01)] | 20 Claims |
1. An integrated circuit structure comprising:
a plurality of semiconductor layers, with upper ones of the plurality of semiconductor layers overlapping respective lower ones of the plurality of semiconductor layers;
a gate stack comprising:
lower portions between the plurality of semiconductor layers; and
an upper portion overlapping the plurality of semiconductor layers, wherein the upper portion comprises:
a conductive layer comprising a bottom portion and opposite vertical portions, wherein the opposite vertical portions comprise a first vertical portion and a second vertical portion on opposite side of, and connecting to opposite ends of, the bottom portion; and
a filling layer over the bottom portion and between the opposite vertical portions of, the conductive layer, wherein the filling layer has a higher silicon atomic percentage than the conductive layer, and wherein the filling layer comprises a top surface continuously extending from the first vertical portion to the second vertical portion.
|