US 12,176,337 B2
Semiconductor devices and methods of manufacturing
Yi-Wen Wu, Xizhi (TW); Po-Yao Chuang, Hsinchu (TW); Meng-Liang Lin, Hsinchu (TW); Techi Wong, Zhubei (TW); Shih-Ting Hung, Sanchong (TW); Po-Hao Tsai, Taoyuan (TW); and Shin-Puu Jeng, Po-Shan Village (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 21, 2022, as Appl. No. 17/869,968.
Application 17/869,968 is a division of application No. 16/902,017, filed on Jun. 15, 2020, granted, now 11,430,776.
Prior Publication US 2022/0359489 A1, Nov. 10, 2022
Int. Cl. H01L 25/18 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/568 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 25/18 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/2505 (2013.01); H01L 2224/25171 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a system on chip device;
an integrated circuit device; and
a redistribution structure physically separating and electrically coupling the integrated circuit device and the system on chip device, wherein the redistribution structure comprises a first metal trace having a concave surface, the concave surface facing the integrated circuit device, the concave surface of the first metal trace forming a concave shape interface with the integrated circuit device and a second metal trace having a flat interface with the system on chip device, wherein the concave shape interface has a first width and the flat interface has a second width, the second width being smaller than the first width.