US 12,176,322 B2
Electronic apparatus and method for manufacturing electronic apparatus
Narumi Sato, Matsumoto (JP); and Yuta Tamai, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kanagawa (JP)
Filed by FUJI ELECTRIC CO., LTD., Kanagawa (JP)
Filed on Apr. 25, 2022, as Appl. No. 17/727,809.
Claims priority of application No. 2021-099262 (JP), filed on Jun. 15, 2021.
Prior Publication US 2022/0399304 A1, Dec. 15, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/83 (2013.01) [H01L 24/32 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45187 (2013.01); H01L 2224/48887 (2013.01); H01L 2224/83224 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
a metal wiring, wherein
the metal wiring includes:
a plurality of first regions covered with a solder layer;
a second region provided between two of the plurality of first regions; and
a third region whose nitrogen amount is 20 atoms % or more, and
an oxygen amount is largest in the second region, followed by at least one of the plurality of first regions, and then by the third region.