US 12,176,274 B2
Multi-die package with multiple heat channels
Jonathan Almeria Noquil, Plano, TX (US); Osvaldo Jorge Lopez, Annandale, NJ (US); and Tianyi Luo, Richardson, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Nov. 26, 2018, as Appl. No. 16/200,278.
Prior Publication US 2020/0168533 A1, May 28, 2020
Int. Cl. H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/49568 (2013.01) [H01L 23/3736 (2013.01); H01L 23/4093 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 25/0657 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a die attach pad, a first lead, and a second lead;
a first die attached to the die attach pad;
a first die attach clip attached to the first die and to the first lead;
a first heat slug, extending from the first die attach clip, with a portion of the first heat slug exposed on an exterior surface of the semiconductor package;
a second die directly attached to the first die attach clip;
a second die attach clip attached to the second die and to the second lead; and
a second heat slug attached to the second die attach clip, the second heat slug extending from the second die attach clip, with a portion of the second heat slug exposed on the exterior surface; wherein the second die is completely above the first die from a cross-sectional view of the semiconductor package, wherein a cross-sectional length of the second die completely aligns with a cross-sectional length of the first die in a vertical direction, the vertical direction perpendicular to a plane along the exterior surface, and wherein the exterior surface of the semiconductor package is at a top in the cross-sectional view of the semiconductor package.