US 12,176,255 B2
Cantilevered dies in ceramic packages
Ramlah Binte Abdul Razak, Plano, TX (US); Paul Merle Emerson, Madison, AL (US); and Mohammad Hadi Motieian Najar, San Jose, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jan. 31, 2022, as Appl. No. 17/589,405.
Prior Publication US 2023/0245935 A1, Aug. 3, 2023
Int. Cl. H01L 23/15 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/15 (2013.01) [H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/73265 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A device, comprising:
a non-conductive substrate having a cavity, a surface of the non-conductive substrate forming a floor of the cavity;
a die pad in the cavity;
a semiconductor die in the cavity and having a first segment coupled to the die pad and a second segment suspended over and facing the floor of the cavity;
a first conductive member in the cavity, the first conductive member coupled to a second conductive member exposed to an exterior of the non-conductive substrate; and
a bond wire coupled to a device side of the semiconductor die and to the first conductive member.