US 12,176,248 B2
Wafer level dicing method and semiconductor device
Ying-Ju Chen, Tuku Township (TW); and Hsien-Wei Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 2, 2021, as Appl. No. 17/391,592.
Application 17/391,592 is a division of application No. 16/019,096, filed on Jun. 26, 2018, granted, now 11,081,391.
Application 16/019,096 is a division of application No. 14/011,580, filed on Aug. 27, 2013, granted, now 10,008,413, issued on Jun. 26, 2018.
Prior Publication US 2021/0366773 A1, Nov. 25, 2021
Int. Cl. H01L 21/78 (2006.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/78 (2013.01) [B23K 26/40 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 24/04 (2013.01); H01L 24/10 (2013.01); H01L 24/14 (2013.01); B23K 2103/50 (2018.08); H01L 23/3114 (2013.01); H01L 23/3192 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/11 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/133 (2013.01); H01L 2224/94 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor substrate;
a seal ring disposed at least in part in the semiconductor substrate;
a pad over the semiconductor substrate;
a conductive line over and electrically connected to the pad;
a connector over and electrically connected to the conductive line; and
a molding layer extending along sidewalls of the connector, wherein a sidewall of the molding layer that is closest to the seal ring is disposed between the connector and a sidewall of the seal ring that is closest to the connector, and wherein the sidewall of the molding layer that is closest to the seal ring extends below a top surface of the seal ring.