US 12,176,134 B2
Multilayer coil component
Masashi Shimoyasu, Tokyo (JP); Shinichi Sato, Tokyo (JP); Seiichi Nakagawa, Tokyo (JP); Mamoru Kawauchi, Tokyo (JP); Shigetoshi Kinouchi, Yurihonjo (JP); Mitsuru Ito, Yurihonjo (JP); and Yuto Shiga, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Oct. 11, 2023, as Appl. No. 18/378,815.
Application 18/378,815 is a continuation of application No. 17/573,301, filed on Jan. 11, 2022.
Application 17/573,301 is a continuation of application No. 16/789,893, filed on Feb. 13, 2020, granted, now 11,270,833, issued on Mar. 8, 2022.
Application 16/789,893 is a continuation of application No. 15/598,606, filed on May 18, 2017, granted, now 10,643,781, issued on May 5, 2020.
Claims priority of application No. 2016-107490 (JP), filed on May 30, 2016; application No. 2016-107491 (JP), filed on May 30, 2016; and application No. 2016-107493 (JP), filed on May 30, 2016.
Prior Publication US 2024/0038436 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/324 (2013.01); H01F 2027/2809 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A multilayer coil component, comprising:
an element body;
a coil disposed in the element body;
a connection conductor disposed in the element body; and
an external electrode disposed on the element body and electrically connected to the coil,
wherein the element body includes a principal surface arranged to constitute a mounting surface;
the connection conductor includes one end connected to the coil and another end connected to the external electrode;
the external electrode includes:
a sintered metal layer formed on the element body and in direct contact with the element body, the sintered metal layer including a portion on the principal surface,
a conductive resin layer formed on the sintered metal layer to cover the sintered metal layer, and
a plating layer formed on the conductive resin layer to cover the conductive resin layer, and
an end of the portion on the principal surface is positioned on an outer side of the coil, when viewed from a direction orthogonal to the principal surface.