US 12,174,673 B2
Cosmetic co-removal of material for electronic device surfaces
Scott Myers, Saratoga, CA (US); Richard Heley, Los Altos, CA (US); Matthew Theobald, San Francisco, CA (US); Adam Stagnaro, Santa Cruz, CA (US); Tang Tan, Palo Alto, CA (US); Richard Dinh, Cupertino, CA (US); and David Pakula, Palo Alto, CA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Aug. 16, 2021, as Appl. No. 17/403,206.
Application 17/403,206 is a continuation of application No. 16/439,163, filed on Jun. 12, 2019, granted, now 11,099,609.
Application 16/439,163 is a continuation of application No. 15/134,621, filed on Apr. 21, 2016, granted, now 10,353,436, issued on Jul. 16, 2019.
Application 15/134,621 is a continuation of application No. 12/794,496, filed on Jun. 4, 2010, granted, now 9,363,905, issued on Jun. 7, 2016.
Claims priority of provisional application 61/325,625, filed on Apr. 19, 2010.
Claims priority of provisional application 61/325,786, filed on Apr. 19, 2010.
Claims priority of provisional application 61/300,780, filed on Feb. 2, 2010.
Prior Publication US 2021/0382525 A1, Dec. 9, 2021
Int. Cl. G06F 1/16 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/42 (2006.01); H04M 1/02 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01)
CPC G06F 1/1656 (2013.01) [G06F 1/1626 (2013.01); G06F 1/1658 (2013.01); G06F 1/1684 (2013.01); G06F 1/1698 (2013.01); H01Q 1/2258 (2013.01); H01Q 1/241 (2013.01); H01Q 1/42 (2013.01); H04M 1/0249 (2013.01); H04M 1/026 (2013.01); H04M 1/0274 (2013.01); H05K 5/02 (2013.01); H05K 5/0208 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49169 (2015.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device comprising:
electrical circuitry; and
an enclosure comprising:
a first structural member formed from a first conductive material and defining a first portion of a side surface of the electronic device and a first internal surface of the enclosure and conductively coupled to the electrical circuitry;
a second structural member formed from a second conductive material and defining a second portion of the side surface of the electronic device and a second internal surface of the enclosure;
a first intermediate element formed from a non-conductive material and defining a third portion of the side surface of the electronic device, the first intermediate element having:
a first portion positioned between the first structural member and the second structural member; and
a second portion extending over at least one of the first internal surface or the second internal surface;
a third structural member formed from a third conductive material and defining a fourth portion of the side surface of the electronic device; and
a second intermediate element formed from the non-conductive material and defining a fifth portion of the side surface of the electronic device, the second intermediate element positioned between the second structural member and the third structural member, the second intermediate element different from the first intermediate element.
 
8. An enclosure for an electronic device, the enclosure comprising:
a first structural member formed from a first metal material and defining a first external surface and a first internal feature of the enclosure, the first structural member conductively coupled to electrical circuitry of the electronic device;
a second structural member formed from a second metal material, the second structural member defining a second external surface and a second internal feature of the enclosure;
a first intermediate element formed from a dielectric material, the first intermediate element comprising:
a first portion positioned at least partially between the first structural member and the second structural member and defining a third external surface;
a second portion extending over the first internal feature of the first structural member; and
a third portion extending over the second internal feature of the second structural member;
a third structural member formed from a third metal material and defining a fourth external surface; and
a second intermediate element formed from the dielectric material and defining a fifth external surface, the second intermediate element positioned between the second structural member and the third structural member, the second intermediate element different from the first intermediate element.
 
15. An enclosure for an electronic device, the enclosure comprising:
a first structural member formed from a first conductive material and defining a first segment of the enclosure, the first structural member operatively coupled to electrical circuitry of the electronic device;
a second structural member formed from a second conductive material and defining a second segment of the enclosure;
a first intermediate element formed from a dielectric material and defining a third segment of the enclosure that extends between the first structural member and the second structural member, the intermediate element defining an internal portion molded over a first internal portion of the first structural member and a second internal portion of the second structural member;
a third structural member formed from a third conductive material and defining a fourth segment of the enclosure; and
a second intermediate element formed from the dielectric material and defining a fifth segment of the enclosure, the second intermediate element extending between the second structural member and the third structural member, the second intermediate element different from the first intermediate element.