US 12,174,446 B2
Sensor lens assembly having non-soldering configuration
Chia-Shuai Chang, Hsin-Chu County (TW); Chien-Chen Lee, Hsin-Chu County (TW); Li-Chun Hung, Hsin-Chu County (TW); and Chien-Yuan Wang, Hsin-Chu County (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by KINGPAK TECHNOLOGY INC., Hsin-Chu County (TW)
Filed on Mar. 8, 2022, as Appl. No. 17/688,976.
Claims priority of provisional application 63/196,685, filed on Jun. 4, 2021.
Claims priority of application No. 110145384 (TW), filed on Dec. 6, 2021.
Prior Publication US 2022/0390703 A1, Dec. 8, 2022
Int. Cl. G02B 7/02 (2021.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/18 (2006.01)
CPC G02B 7/021 (2013.01) [H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/181 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A sensor lens assembly having a non-soldering configuration, comprising:
a circuit board having a first surface and a second surface that is opposite to the first surface, wherein the first surface of the circuit board includes a chip-bonding region and a plurality of bonding pads that are arranged outside of the chip-bonding region;
an optical module including:
a frame fixed on the first surface of the circuit board;
at least one lens assembled into the frame, wherein a central axis of the at least one lens passes through the chip-bonding region; and
a filtering sheet assembled into the frame and positioned along the central axis, wherein the frame and the filtering sheet jointly define a distribution space, and the chip-bonding region and the bonding pads are arranged in the distribution space;
a sensor chip including a sensing region arranged on a top surface thereof and a plurality of connection pads that are arranged on the top surface and outside of the sensing region, wherein the sensor chip is disposed on the chip-bonding region, and the sensing region is positioned along the central axis;
a plurality of wires, wherein the bonding pads are respectively and electrically coupled to the connection pads through the wires; and
a cover arranged in the distribution space and including:
a light-permeable sheet having two anti-reflection films that are respectively coated on two opposite sides thereof and that respectively define an inner surface and an outer surface, wherein the light-permeable sheet has a ring-shaped notch recessed in an edge of the inner surface, and the two anti-reflection films are not arranged in the ring-shaped notch; and
an opaque frame formed on the ring-shaped notch, wherein the opaque frame is disposed on the first surface of the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame, and wherein the opaque frame does not cover the inner surface of the light-permeable sheet.