| CPC G02B 6/43 (2013.01) [G02B 6/4214 (2013.01); H01L 25/167 (2013.01); G02B 6/4246 (2013.01)] | 5 Claims |
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1. An optical interconnect comprising:
a first waveguide on top of an interconnect layer of an integrated circuit (IC) chip, the IC chip comprising an optical interconnect IC, the IC chip including a semiconductor substrate and an interconnect layer on top of the semiconductor substrate;
an optical transmitter embedded in the first waveguide, the optical transmitter comprising a microLED having a bottom connected to a pad coupled to a first electrical signal path in the interconnect layer, a top contact of the microLED coupled to a second electrical signal path in the interconnect layer;
transmit circuitry in the semiconductor substrate of the optical interconnect IC, the transmit circuitry configured to drive the microLED;
a photodetector in the semiconductor substrate of the IC chip, under a level of the interconnect layer, the optical receiver optically coupled to the first waveguide;
receive circuitry in the semiconductor substrate of the optical interconnect IC, the receive circuitry coupled to the photodetector; and
wherein a region of the interconnect layer above the photodetector has no metal layers; and
wherein the microLED has an emitting region of less than 10 microns by 10 microns.
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