US 12,174,440 B2
Photonics package integration
Rabiul Islam, Hsinchu (TW); Stefan Rusu, Sunnyvale, CA (US); and Nick Samra, Austin, TX (US)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 29, 2022, as Appl. No. 17/816,222.
Application 17/816,222 is a continuation of application No. 17/086,646, filed on Nov. 2, 2020, granted, now 11,460,651.
Application 17/086,646 is a continuation of application No. 16/282,075, filed on Feb. 21, 2019, granted, now 10,823,921, issued on Nov. 3, 2020.
Claims priority of provisional application 62/764,710, filed on Aug. 15, 2018.
Prior Publication US 2022/0365299 A1, Nov. 17, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/43 (2006.01); G02B 6/42 (2006.01); H01L 33/58 (2010.01)
CPC G02B 6/43 (2013.01) [G02B 6/4204 (2013.01); G02B 6/424 (2013.01); H01L 33/58 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a first substrate;
a plurality of light sources; and
an interconnect package connected to the first substrate, the interconnect package comprising a photonics die (pDie) connected to an integrated switch Application Specific Integrated Circuit (ASIC) integrated into one package, wherein the pDie and the integrated switch ASIC are arranged in a diving-board configuration such that a portion of the pDie extends beyond an edge of the integrated switch ASIC, and wherein the pDie is disposed in a cutout formed in the first substrate; and
a plurality of optical elements disposed in a plurality of openings in the substrate and attached to the portion of the pDie that extends beyond the edge of the integrated switch ASIC, wherein each optical element of the plurality of optical elements is optically aligned with a respective light source of the plurality of light sources.