US 12,174,438 B2
Optical module with structured protective cover
Guangchao Du, Shandong (CN); Yongzheng Tang, Shandong (CN); Tao Wu, Shandong (CN); Jianwei Mu, Shandong (CN); Shaoshuai Sui, Shandong (CN); Jihong Han, Shandong (CN); Sitao Chen, Shandong (CN); Qian Shao, Shandong (CN); Bangyu Yu, Shandong (CN); Benzheng Dong, Shandong (CN); Xiangxun Sun, Shandong (CN); and Fabu Xu, Shandong (CN)
Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao (CN)
Filed by HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed on Sep. 22, 2023, as Appl. No. 18/472,638.
Application 18/472,638 is a continuation of application No. 17/235,367, filed on Apr. 20, 2021, granted, now 11,828,991.
Application 17/235,367 is a continuation in part of application No. PCT/CN2020/133868, filed on Dec. 4, 2020.
Application 17/235,367 is a continuation in part of application No. PCT/CN2019/127211, filed on Dec. 20, 2019.
Claims priority of application No. 201910199334.9 (CN), filed on Mar. 15, 2019; application No. 201910199347.6 (CN), filed on Mar. 15, 2019; application No. 201910199953.8 (CN), filed on Mar. 15, 2019; and application No. 202010317005.2 (CN), filed on Apr. 21, 2020.
Prior Publication US 2024/0012212 A1, Jan. 11, 2024
Int. Cl. G02B 6/42 (2006.01); H04B 10/50 (2013.01)
CPC G02B 6/4215 (2013.01) [G02B 6/4206 (2013.01); G02B 6/4266 (2013.01); H04B 10/503 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a shell;
a circuit board, wherein the circuit board is located within the shell;
a base, wherein the base is located on the circuit board or in a through hole of the circuit board;
a laser assembly, wherein the laser assembly is located on the base and electrically connected to the circuit board, and is configured to provide first light;
a silicon optical chip, wherein the silicon optical chip is located on the base, electrically connected to the circuit board and optically connected to the laser assembly, and is configured to receive the first light, and modulate the first light to form a first optical signal; and
a protective cover, wherein the protective cover covers on the circuit board; the laser assembly and a wiring region of the laser assembly are encapsulated between the protective cover and the circuit board, and the protective cover is configured to protect electrical connection wires between the laser assembly and the circuit board; and/or, the silicon optical chip and a wiring region of the silicon optical chip are encapsulated between the protective cover and the circuit board, and the protective cover is configured to protect electrical connection wires between the silicon optical chip and the circuit board; wherein
the shell includes at least one heat conduction column, the at least one heat conduction column is disposed on an inner wall of the shell and is in thermal conductive connection with the laser assembly and/or the silicon optical chip, and each heat conduction column is configured to conduct the heat inside the shell to the shell; and
the protective cover includes at least one escape opening that allow the at least one heat conduction column to pass and enter an inside of the protective cover.