US 12,174,437 B2
Optical module with slotted laser assembly box
Guangchao Du, Shandong (CN); Yongzheng Tang, Shandong (CN); Tao Wu, Shandong (CN); Jianwei Mu, Shandong (CN); Shaoshuai Sui, Shandong (CN); Jihong Han, Shandong (CN); Sitao Chen, Shandong (CN); Qian Shao, Shandong (CN); Bangyu Yu, Shandong (CN); Benzheng Dong, Shandong (CN); Xiangxun Sun, Shandong (CN); and Fabu Xu, Shandong (CN)
Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao (CN)
Filed by HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed on Sep. 22, 2023, as Appl. No. 18/472,503.
Application 18/472,503 is a continuation of application No. 17/235,367, filed on Apr. 20, 2021, granted, now 11,828,991.
Application 17/235,367 is a continuation in part of application No. PCT/CN2020/133868, filed on Dec. 4, 2020.
Application 17/235,367 is a continuation in part of application No. PCT/CN2019/127211, filed on Dec. 20, 2019.
Claims priority of application No. 201910199334.9 (CN), filed on Mar. 15, 2019; application No. 201910199347.6 (CN), filed on Mar. 15, 2019; application No. 201910199953.8 (CN), filed on Mar. 15, 2019; and application No. 202010317005.2 (CN), filed on Apr. 21, 2020.
Prior Publication US 2024/0012210 A1, Jan. 11, 2024
Int. Cl. G02B 6/42 (2006.01); H04B 10/50 (2013.01)
CPC G02B 6/4215 (2013.01) [G02B 6/4206 (2013.01); G02B 6/4266 (2013.01); H04B 10/503 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a shell, wherein the shell includes an upper shell and a lower shell;
a circuit board, wherein the circuit board is disposed between the upper shell and the lower shell;
a base, wherein the base is located on the circuit board or in a through hole of the circuit board;
a laser assembly, wherein the laser assembly is located on the base and electrically connected to the circuit board, and is configured to provide first light; and
a silicon optical chip, wherein the silicon optical chip is located on the base, electrically connected to the circuit board and optically connected to the laser assembly, and is configured to receive the first light, and modulate the first light to form a first optical signal; wherein
the laser assembly including:
an upper box, wherein the upper box and the base are combined to provide a cavity;
conductive substrates, wherein the conductive substrates are at least partially located in the cavity, and are electrically connected to the circuit board; and
laser chips, wherein the laser chips are located on the conductive substrates, and are configured to provide the first light for the silicon optical chip; wherein
the cavity has an opening and a slot, the opening is located in an optical path where light emitted by the laser chips is emitted to the silicon optical chip, and the slot allows the conductive substrates or wires for electrically connecting the conductive substrates to the circuit board to extend out of the cavity.