US 12,174,270 B2
Magnetic sensor
Chengbin Lin, Tokyo (JP); and Takato Fukui, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Feb. 8, 2023, as Appl. No. 18/107,158.
Prior Publication US 2023/0258741 A1, Aug. 17, 2023
Int. Cl. G01R 33/00 (2006.01)
CPC G01R 33/0017 (2013.01) 15 Claims
OG exemplary drawing
 
1. A magnetic sensor comprising:
first and second magnetic layers opposed to each other through a magnetic gap;
a magnetosensitive element disposed on a magnetic path formed by the magnetic gap; and
a compensating coil wound around the first and second magnetic layers,
wherein the first magnetic layer, second magnetic layer, magnetosensitive element, and compensating coil are integrated in a sensor chip.