US 12,174,246 B2
Security circuitry for bonded structures
Javier A. DeLaCruz, San Jose, CA (US); Belgacem Haba, Saratoga, CA (US); and Guy Regev, Valley Village, CA (US)
Assigned to Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Jun. 7, 2022, as Appl. No. 17/805,817.
Application 17/805,817 is a continuation of application No. 16/881,621, filed on May 22, 2020, granted, now 11,385,278.
Claims priority of provisional application 62/953,069, filed on Dec. 23, 2019.
Claims priority of provisional application 62/852,175, filed on May 23, 2019.
Prior Publication US 2022/0373593 A1, Nov. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); G01R 31/28 (2006.01); G01R 31/70 (2020.01)
CPC G01R 31/2853 (2013.01) [G01R 31/70 (2020.01); H01L 24/10 (2013.01); H01L 24/80 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a semiconductor element with first circuitry;
a protective element directly bonded to the semiconductor element along a bond interface without an adhesive, the protective element comprising an obstructive material disposed over the first circuitry; and
a detection circuit capable of detecting external access to the protective element.