US 12,173,969 B2
Separate capillary vapor chamber structure for dual heat sources
Chun-Hung Lin, New Taipei (TW)
Assigned to TAIWAN MICROLOOPS CORP., New Taipei (TW)
Filed by TAIWAN MICROLOOPS CORP., New Taipei (TW)
Filed on Jan. 19, 2023, as Appl. No. 18/098,722.
Claims priority of application No. 111148594 (TW), filed on Dec. 16, 2022.
Prior Publication US 2024/0200879 A1, Jun. 20, 2024
Int. Cl. F28D 15/04 (2006.01); F28D 15/02 (2006.01)
CPC F28D 15/046 (2013.01) [F28D 15/0266 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A vapor chamber structure, transferring heat for a low heat source and a high heat source, the vapor chamber structure comprising:
a lower plate, comprising a lower capillary layer disposed on an inner side thereof; and
an upper plate, covering the lower plate, and comprising an upper capillary layer disposed on an inner side thereof;
wherein, the lower plate and the upper plate cover each other to define a hollow interior, an evaporation area corresponding to the low heat source and the high heat source, a first condensation area extended from one side of the evaporation area and adjacent to the low heat source, and a second condensation area extended from another side of the evaporation area and adjacent to the high heat source, and taper regions are formed between the evaporation area and the first condensation area and between the evaporation area and the second condensation area respectively; and
wherein, the lower capillary layer of the lower plate is extended from the first condensation area to an end of the second condensation area through the evaporation area, the upper capillary layer of the upper plate is extended from an end of the first condensation area to the evaporation area to define a cut edge, and a length of the upper capillary layer is smaller than a length of the lower capillary layer.