US 12,173,411 B2
Cutting tool
Haruyo Fukui, Osaka (JP); Nozomi Tsukihara, Osaka (JP); Anongsack Paseuth, Osaka (JP); and Toshihiro Tabata, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/033,361
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed Sep. 22, 2022, PCT No. PCT/JP2022/035450
§ 371(c)(1), (2) Date Apr. 24, 2023,
PCT Pub. No. WO2024/062611, PCT Pub. Date Mar. 28, 2024.
Prior Publication US 2024/0102173 A1, Mar. 28, 2024
Int. Cl. B23B 27/14 (2006.01); C23C 28/04 (2006.01)
CPC C23C 28/044 (2013.01) [B23B 27/146 (2013.01); B23B 27/148 (2013.01); C23C 28/042 (2013.01); B23B 2224/24 (2013.01); B23B 2224/36 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A cutting tool comprising a substrate and a coating film disposed on the substrate, wherein
the coating film includes a first A layer,
the first A layer comprises a first unit layer and a third unit layer that are alternately stacked,
the first unit layer is composed of Ti1-a-bAlaCebN,
a is 0.350 or more and 0.650 or less,
b is 0.001 or more and 0.100 or less,
the third unit layer is composed of AldCr1-d-eMeN,
M is silicon or boron,
d is 0.40 or more and 0.75 or less,
e is more than 0 and 0.05 or less, and
a and d satisfy a relationship of d>a;
wherein the coating film further includes a second unit layer disposed between the substrate and the first A layer;
wherein the second unit layer has a composition that is the same as a composition of the first unit layer or a composition of the third unit layer;
wherein the second unit layer has a thickness of 0.1 μm or more; and
wherein the thickness of the second unit layer is 2.0 times or more and 500 times or less than a thickness of the first unit layer or the third unit layer.