US 12,173,201 B2
Copper-clad laminate and method of forming the same
Jennifer Adamchuk, Marlborough, MA (US); Dale Thomas, Rochdale (GB); Meghann White, Bedford, NH (US); Sethumadhavan Ravichandran, Shrewsbury, MA (US); and Gerard T. Buss, Bedford, NH (US)
Assigned to VERSIV COMPOSITES LIMITED, Kilrush (IE)
Filed by VERSIV COMPOSITES LIMITED, Kilrush (IE)
Filed on Dec. 9, 2021, as Appl. No. 17/643,452.
Claims priority of provisional application 63/126,111, filed on Dec. 16, 2020.
Prior Publication US 2022/0195253 A1, Jun. 23, 2022
Int. Cl. C09J 7/29 (2018.01); C09J 7/38 (2018.01); C09J 11/04 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01)
CPC C09J 7/29 (2018.01) [C09J 7/381 (2018.01); C09J 11/04 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 3/4644 (2013.01); C09J 2203/326 (2013.01); C09J 2301/41 (2020.08); C09J 2400/166 (2013.01); C09J 2427/00 (2013.01); C09J 2427/006 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A copper-clad laminate comprising:
a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material,
wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.