	US 12,173,112 B2
	Epoxy resin systems
Amitabh Bansal, Sugar Land, TX (US); Larry Steven Corley, Kingsport, TN (US); Diana Sepulveda-Camarena, Sugar Land, TX (US); Jennifer W. Chung, Katy, TX (US); Leeanne Taylor, Columbus, OH (US); and Alla Hale, South San Francisco, CA (US)
Filed by Westlake Epoxy Inc., Houston, TX (US)
Filed on Jun. 10, 2022, as Appl. No. 17/837,435.
Application 17/837,435 is a continuation of application No. 16/126,612, filed on Sep. 10, 2018, granted, now 11,359,047.
Claims priority of provisional application 62/558,182, filed on Sep. 13, 2017.
Prior Publication US 2022/0298295 A1, Sep. 22, 2022
Int. Cl. C08G 59/36 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08G 59/68 (2006.01)

CPC C08G 59/36 (2013.01) [C08G 59/3245 (2013.01); C08G 59/4071 (2013.01); C08G 59/5073 (2013.01); C08G 59/56 (2013.01); C08G 59/686 (2013.01)]

14 Claims

1. An epoxy resin system, comprising:

an epoxy resin blend comprising:

a liquid epoxy resin based on bisphenol F; and

a first curing agent comprising a polyarylene alkylphosphonate, and

an aryl phosphate; and

a second curing agent selected from the group consisting of a compound having an imidazole group, a compound having a fused imidazole ring, an amine and combinations thereof,

wherein the epoxy resin system comprises a viscosity of 900 mPa-s or less at 60° C.