US 12,172,886 B2
Micro-electro-mechanical system (MEMS) vibration sensor and fabricating method thereof
Hsien-Lung Ho, New Taipei (TW); and Hsi-Wen Tung, New Taipei (TW)
Assigned to UPBEAT TECHNOLOGY CO., LTD, New Taipei (TW)
Filed by UPBEAT TECHNOLOGY Co., Ltd, New Taipei (TW)
Filed on May 18, 2022, as Appl. No. 17/747,856.
Claims priority of provisional application 63/189,749, filed on May 18, 2021.
Prior Publication US 2022/0371881 A1, Nov. 24, 2022
Int. Cl. B81B 3/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01)
CPC B81B 3/0021 (2013.01) [B81B 7/02 (2013.01); B81C 1/00373 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/04 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0156 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A micro-electro-mechanical system (MEMS) vibration sensor, comprising:
a substrate, comprising a first supporting-portion and a cavity; and
a sensing-device disposed on the substrate, comprising:
a second supporting-portion, correspondingly disposed over and connected with the first supporting-portion via a first dielectric material;
a first sensing-unit, disposed on the cavity and connected to the second supporting-portion;
a first mass-block, disposed on the cavity;
a second sensing-unit, disposed on the first sensing-unit and the first mass-block, wherein the second sensing-unit connects to the first mass-block via a second dielectric material; and a gap is forming between the second sensing-unit and the first sensing-unit; wherein the second sensing-unit further comprises a third supporting-portion correspondingly disposed over and connected to the second supporting-portion via a third dielectric material;
a first metal pad, disposed on the third supporting-portion and electrically coupled with the first sensing-unit; and
a second metal pad, disposed on the third supporting-portion and electrically coupled with the second sensing-unit.