US 12,172,412 B2
Cover tape for packing electronic component, package, and package set
Ayuro Murata, Tokyo-to (JP); Satoshi Endo, Tokyo-to (JP); Takashi Mihara, Tokyo-to (JP); and Nobuyuki Tominaga, Tokyo-to (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Appl. No. 17/767,238
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
PCT Filed Oct. 9, 2020, PCT No. PCT/JP2020/038305
§ 371(c)(1), (2) Date Apr. 7, 2022,
PCT Pub. No. WO2021/070936, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 2019-187868 (JP), filed on Oct. 11, 2019.
Prior Publication US 2022/0396057 A1, Dec. 15, 2022
Int. Cl. B32B 27/08 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B65D 75/36 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01)
CPC B32B 27/08 (2013.01) [B32B 7/12 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B65D 75/367 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/21 (2013.01); B32B 2307/31 (2013.01); B32B 2307/414 (2013.01); B32B 2307/518 (2013.01); B32B 2307/732 (2013.01); B32B 2439/40 (2013.01); H01L 21/67259 (2013.01); H01L 21/67356 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A cover tape for packing an electronic component comprising:
a substrate layer;
a heat sealing layer placed on one surface side of the substrate layer; and
an intermediate layer placed between the substrate layer and the heat sealing layer, and
a transmitted image definition based on JIS K 7374, with an optical comb width set to 0.5 mm, is 30% or more.