US 12,172,262 B2
Irregular mechanical motion detection systems and method
Chunhung Chen, Hsinchu (TW); Yu Chi Tsai, Hsinchu (TW); Chin Wei Chuang, Hsinchu (TW); Bo-An Chen, Hsinchu (TW); Sheng-Chen Wang, Hsinchu (TW); and Chen-Hua Tsai, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 21, 2023, as Appl. No. 18/339,099.
Application 18/339,099 is a continuation of application No. 16/431,957, filed on Jun. 5, 2019, granted, now 11,731,232.
Claims priority of provisional application 62/752,598, filed on Oct. 30, 2018.
Prior Publication US 2023/0330803 A1, Oct. 19, 2023
Int. Cl. B24B 37/005 (2012.01)
CPC B24B 37/005 (2013.01) 20 Claims
OG exemplary drawing
 
1. A mechanical motion irregularity prediction system, comprising:
a plurality of mechanical components of a chemical polishing apparatus including a rotatable platen and a polishing head;
defect prediction circuitry configured to, in operation, predict an irregular motion of at least one mechanical component of the plurality of mechanical components of the chemical polishing apparatus based on a plurality of parameters sensed by a plurality of sensors associated with respective motions of the plurality of mechanical components of the chemical polishing apparatus, a first sensor of the plurality of sensors senses a respective parameter of the plurality of parameters relative to the rotatable platen and a second sensor of the plurality of sensors senses a respective parameter of the plurality of parameters relative to the polishing head, and
wherein, in response to the defect prediction circuitry predicting the irregular motion of the at least one mechanical component being irregular relative to a normal operation motion of the at least one mechanical component, outputting a signal automatically stopping the at least one mechanical component.