US 12,172,184 B2
Method for applying a coating to at least one electronic component, sensor arrangement comprising a coating and coating carrier
Subramanian Ravichandran, Deutschlandsberg (AT); and Gerhard Hojas, Söding-St. Johann (AT)
Assigned to TDK Electronics AG, Munich (DE)
Appl. No. 18/029,765
Filed by TDK Electronics AG, Munich (DE)
PCT Filed Aug. 2, 2022, PCT No. PCT/EP2022/071688
§ 371(c)(1), (2) Date Mar. 31, 2023,
PCT Pub. No. WO2023/036520, PCT Pub. Date Mar. 16, 2023.
Claims priority of application No. 10 2021 123 241.4 (DE), filed on Sep. 8, 2021.
Prior Publication US 2024/0001395 A1, Jan. 4, 2024
Int. Cl. B05C 5/00 (2006.01); B05C 11/10 (2006.01); G01K 7/22 (2006.01)
CPC B05C 5/002 (2013.01) [B05C 11/10 (2013.01); G01K 7/22 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method of applying a coating to at least one electronic component, comprising:
A) Providing a coating carrier having
a main base,
a coating base arranged on the main base and comprising a coating-base recess,
a moveable reservoir comprising a reservoir recess;
B) Filling a coating material into the reservoir recess;
C) Sliding the reservoir along a longitudinal axis of the coating carrier such that the coating-base recess is filled with coating material;
D) Providing at least one electronic component and dipping at least parts of the electronic component into the coating material provided in the coating-base recess to form a coating of the electronic component.