US 12,172,168 B2
Thermal platform and a method of fabricating a thermal platform
Christophe Antoine, London (GB); Helen Berney, Limerick (IE); Bernard Stenson, Upper Manister (IE); Ramji Sitaraman Lakshmanan, Limerick (IE); William Allan Lane, Waterfall (IE); Himanshu Jain, Limerick (IE); Christina B. McLoughlin, Crecora (IE); Shane Geary, Sixmilebridge (IE); Michael C. W. Coln, Lexington, MA (US); Donal McAuliffe, Raheen (IE); and Roman Trogan, Needham, MA (US)
Assigned to Analog Devices International Unlimited Company, Limerick (IE)
Appl. No. 17/621,184
Filed by Analog Devices International Unlimited Company, Limerick (IE)
PCT Filed Jun. 22, 2020, PCT No. PCT/EP2020/067365
§ 371(c)(1), (2) Date Dec. 20, 2021,
PCT Pub. No. WO2020/254691, PCT Pub. Date Dec. 24, 2020.
Claims priority of provisional application 62/864,668, filed on Jun. 21, 2019.
Prior Publication US 2022/0126300 A1, Apr. 28, 2022
Int. Cl. B01L 7/00 (2006.01)
CPC B01L 7/52 (2013.01) [B01L 2200/12 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/123 (2013.01); B01L 2300/1827 (2013.01); B01L 2300/1883 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A microfabricated thermal platform for controlling a temperature of a fluid or other material positioned over the thermal platform, the platform comprising a plurality of microfabricated layers, the platform further comprising:
a thermally-insulating layer, formed from an organic polymer, having a predefined thermal conductivity, the thermally-insulating layer configured to provide thermal insulation between the fluid or other material positioned over the thermal platform, and a substrate positioned beneath the thermal platform;
an electrically-conductive layer, formed on or adjacent an upper surface of the thermally-insulative layer, the electrically-conductive layer patterned to define at least one heating element and at least one track;
one or more electrically conductive vias, formed in the thermally-insulating layer, the vias electrically coupled to the electrically-conductive layer, and wherein the at least one track respectively extends from a corresponding individual one of the at least one heating element to a corresponding position that is respectively aligned with a corresponding individual one of the one or more electrically conductive vias;
an electrically-insulative layer, formed over the electrically-conductive layer; and
at least one thermal plate, formed over the electrically-insulative layer;
wherein the at least one heating element and the at least one thermal plate define a thermal site in which the temperature of a fluid or other material positioned over the thermal platform is controllable.