US 12,171,555 B2
Wearable, non-intrusive microneedle sensor
Farshad Tehrani, San Diego, CA (US); Joseph Wang, San Diego, CA (US); and Hazhir Teymourian, San Diego, CA (US)
Assigned to The Regents of the University of California, Oakland, CA (US)
Filed by The Regents of the University of California, Oakland, CA (US)
Filed on Jan. 8, 2024, as Appl. No. 18/407,265.
Application 18/407,265 is a continuation of application No. 18/313,168, filed on May 5, 2023, granted, now 11,877,846.
Application 18/313,168 is a continuation of application No. 17/860,070, filed on Jul. 7, 2022, granted, now 11,684,298, issued on Jun. 27, 2023.
Claims priority of provisional application 63/219,325, filed on Jul. 7, 2021.
Prior Publication US 2024/0180459 A1, Jun. 6, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 5/1473 (2006.01); A61B 5/00 (2006.01)
CPC A61B 5/14735 (2013.01) [A61B 5/0022 (2013.01); A61B 5/685 (2013.01); A61B 2562/046 (2013.01); A61B 2562/125 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A wearable biosensor device, comprising:
a microneedle array comprising a substrate integral with microneedles at a top surface of the substrate, the microneedle array comprising an electrically insulative material and coated with an electrically conductive layer, wherein each of the microneedles comprises a tip region, a body region and a base, and wherein at least one of the microneedles is configured as a working electrode functionalized with at least one chemical layer on the electrically conductive layer to interact with analytes in a biofluid and configured to produce electrical signals associated with reactions detectable at the working electrode,
a cover unit fitted to the substrate, wherein the cover unit comprises first openings aligned so that at least a portion of the microneedles extends from the cover unit, and wherein microfluidic channels containing a custom cured resin are positioned on an inner surface of the cover unit or in or on the top surface of the substrate, the custom cured resin being an electrical insulator and also positioned as a base structure at the base of the microneedles thereby sealing the first openings and strengthening the microneedle array, and
an electronics unit positioned underneath the microneedle array and electrically connected thereto by a plurality of electrical interconnections.