US 11,856,836 B2
Semiconductor device comprising adhesive layer and resin layer
Seiji Yasumoto, Tochigi (JP); Kayo Kumakura, Tochigi (JP); Yuka Sato, Tochigi (JP); Satoru Idojiri, Tochigi (JP); Hiroki Adachi, Tochigi (JP); and Kenichi Okazaki, Tochigi (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd.
Filed by Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken (JP)
Filed on Sep. 20, 2021, as Appl. No. 17/479,329.
Application 17/479,329 is a continuation of application No. 16/493,104, granted, now 11,133,491, previously published as PCT/IB2018/051417, filed on Mar. 6, 2018.
Claims priority of application No. 2017-050894 (JP), filed on Mar. 16, 2017; and application No. 2017-098999 (JP), filed on May 18, 2017.
Prior Publication US 2022/0013754 A1, Jan. 13, 2022
Int. Cl. H01L 27/15 (2006.01); H10K 71/00 (2023.01); H10K 50/842 (2023.01); H10K 71/40 (2023.01); H10K 77/10 (2023.01)
CPC H10K 71/00 (2023.02) [H10K 50/8426 (2023.02); H10K 71/40 (2023.02); H10K 77/111 (2023.02)] 14 Claims
OG exemplary drawing
 
1. A light-emitting device comprising:
a flexible substrate;
an adhesive layer over the flexible substrate;
a resin layer containing titanium over the adhesive layer;
a first insulator over the resin layer;
a first conductor over the first insulator;
a second insulator over the first conductor;
a semiconductor layer over the second insulator;
a third insulator over the semiconductor layer;
a second conductor over the third insulator;
a first electrode over the second conductor;
an EL layer over the first electrode; and
a second electrode over the EL layer.