US 11,856,835 B2
Method for manufacturing display device
Tetsuya Hanamoto, Sakai (JP)
Assigned to SHARP KABUSHIKI KAISHA, Sakai (JP)
Appl. No. 17/278,941
Filed by SHARP KABUSHIKI KAISHA, Sakai (JP)
PCT Filed Sep. 27, 2018, PCT No. PCT/JP2018/036057
§ 371(c)(1), (2) Date Mar. 23, 2021,
PCT Pub. No. WO2020/065856, PCT Pub. Date Apr. 2, 2020.
Prior Publication US 2022/0037629 A1, Feb. 3, 2022
Int. Cl. H10K 71/00 (2023.01); H10K 59/122 (2023.01); H10K 59/12 (2023.01); H10K 71/80 (2023.01); H10K 102/00 (2023.01)
CPC H10K 71/00 (2023.02) [H10K 59/1201 (2023.02); H10K 59/122 (2023.02); H10K 71/80 (2023.02); H10K 2102/311 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A method for manufacturing a display device including a light-emitting element, the method comprising:
storing, in a manufacturing process of the display device, a plurality of abutting positions where a back face of a support substrate locally abuts a manufacturing apparatus;
forming, on a surface of the support substrate on a side on which the light-emitting element is to be formed, a peeling layer at a position opposing at least one position of the plurality of abutting positions stored;
forming, on the support substrate, a resin layer to cover the peeling layer;
forming a TFT layer on the resin layer;
forming the light-emitting element on the TFT layer; and
peeling the support substrate and the resin layer.