US 11,856,832 B2
Electronic panel and method for manufacturing the same
Ji-hyun Kim, Hwaseong-si (KR); Junhong Park, Suwon-si (KR); Jun Chun, Hwaseong-si (KR); Euisuk Jung, Seoul (KR); Hoon Kang, Yongin-si (KR); and Jeongmin Park, Seoul (KR)
Assigned to Samsung Display Co., Ltd., Yongin-Si (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Feb. 22, 2021, as Appl. No. 17/182,042.
Application 17/182,042 is a division of application No. 16/440,788, filed on Jun. 13, 2019, granted, now 10,957,747.
Claims priority of application No. 10-2018-0105478 (KR), filed on Sep. 4, 2018.
Prior Publication US 2021/0175293 A1, Jun. 10, 2021
Int. Cl. H01L 27/00 (2006.01); H10K 59/40 (2023.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H10K 59/124 (2023.01); H10K 71/00 (2023.01); H10K 99/00 (2023.01)
CPC H10K 59/40 (2023.02) [G06F 3/044 (2013.01); G06F 3/0412 (2013.01); H10K 59/124 (2023.02); H10K 71/621 (2023.02); H10K 99/00 (2023.02); H01L 27/00 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic panel, the method comprising:
forming first conductive patterns on a base substrate;
forming a first organic insulation layer covering the first conductive patterns;
forming a preliminary conductive layer on the first organic insulation layer;
forming a preliminary pattern layer on the preliminary conductive layer;
etching the preliminary pattern layer by using a first mask to form a plurality of organic patterns;
patterning the preliminary conductive layer by using the plurality of organic patterns as a second mask to form second conductive patterns; and
forming a second organic insulation layer on the second conductive patterns,
wherein the plurality of organic patterns are made of the same material as the second organic insulation layer.