US 11,856,828 B2
Display device and method of manufacturing the same
Joo-Nyung Jang, Seoul (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Oct. 11, 2021, as Appl. No. 17/498,148.
Application 17/498,148 is a division of application No. 16/790,354, filed on Feb. 13, 2020, granted, now 11,145,706.
Claims priority of application No. 10-2019-0074461 (KR), filed on Jun. 21, 2019.
Prior Publication US 2022/0093719 A1, Mar. 24, 2022
Int. Cl. H10K 59/131 (2023.01); H01L 23/00 (2006.01); H10K 59/12 (2023.01)
CPC H10K 59/131 (2023.02) [H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29257 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/12044 (2013.01); H10K 59/1201 (2023.02)] 17 Claims
OG exemplary drawing
 
1. A method of manufacturing a display device, the method comprising:
providing a lower substrate having a display area and a pad area;
forming a display structure in the display area of the lower substrate;
forming pad electrodes in the pad area of the lower substrate to be spaced apart from each other in a first direction parallel to a top surface of the lower substrate;
forming an upper substrate on the display structure to face the lower substrate in the display area;
forming a conductive film member including a non-cured resin layer and conductive balls arranged in a lattice shape on the pad electrodes, the non-cured resin layer overlapping the pad electrodes;
forming a film package on the non-cured resin layer, the film package including bump electrodes overlapping the pad electrodes; and
placing a pre-cured resin on one side of the pad electrodes,
wherein at least a portion of the pre-cured resin directly contacts a side surface of the bump electrodes.