US 11,856,730 B2
Liquid-cooled integrated cabinet
Changjiang Ge, Beijing (CN); Minghui Sun, Beijing (CN); Hao Peng, Beijing (CN); Bin Yang, Beijing (CN); and Zhenhui Li, Beijing (CN)
Assigned to CMOTION TECHNOLOGIES LIMITED, Hongkong (CN)
Filed by CMOTION TECHNOLOGIES LIMITED, HongKong (CN)
Filed on Sep. 6, 2021, as Appl. No. 17/467,284.
Claims priority of application No. 202011211326.0 (CN), filed on Nov. 3, 2020; and application No. 202022504714.X (CN), filed on Nov. 3, 2020.
Prior Publication US 2022/0141999 A1, May 5, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 7/20254 (2013.01); H05K 7/20718 (2013.01); H05K 7/20781 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A liquid-cooled integrated cabinet, wherein the liquid-cooled integrated cabinet comprises a main body; a power distribution module is provided at an upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on another side of the lower end of the main body; each of the multiple computing power modules is cooled by a respective liquid-cooled module, and each liquid-cooled module is detachable from or attachable to the main body in a front-and-rear direction;
the cooling fans bear 8%-12% of the heat dissipation capacity;
a cold plate shell in each liquid-cooled module thermally contacts with a chip in the computing power module;
a front end of the main body is provided with multiple hoses for cooling medium to circulate; each liquid-cooled module corresponds to a respective hose; cooling medium flows through the respective hose and the respective liquid-cooled module, and then cools down the respective computing power module.