US 11,856,711 B2
Rogowski coil integrated in glass substrate
Alexander Breymesser, Villach (AT); Francisco Javier Santos Rodriguez, Villach (AT); and Klaus Sobe, Klagenfurt (AT)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Oct. 28, 2020, as Appl. No. 17/082,697.
Prior Publication US 2022/0132677 A1, Apr. 28, 2022
Int. Cl. H05K 3/40 (2006.01); G01R 31/52 (2020.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01)
CPC H05K 3/4038 (2013.01) [G01R 31/52 (2020.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 3/0029 (2013.01); H05K 3/10 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A method of forming a current measurement device, the method comprising:
providing a glass substrate comprising first and second substantially planar surfaces that are opposite one another;
forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces; and
forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together,
wherein forming the plurality of through-vias comprises applying radiation to the glass substrate,
wherein the conductive tracks and the through-vias collectively form a coil structure in the glass substrate.