US 11,856,706 B2
Method and system for improving the operation of semiconductor processing
Hsui Yang, Santa Clara, CA (US); Yao-Hung Yang, Santa Clara, CA (US); Jeevan Shanbhag, Cupertino, CA (US); Chien-Min Liao, San Jose, CA (US); Earl Hunter, Lakeway, TX (US); David Ganon, Raanana (IL); Mariana Luigi, Los Gatos, CA (US); Siamak Salimian, Los Altos, CA (US); Tom K. Cho, Los Altos, CA (US); and Chun-Chung Chen, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 3, 2019, as Appl. No. 16/702,031.
Prior Publication US 2021/0168979 A1, Jun. 3, 2021
Int. Cl. H05K 13/08 (2006.01); H01L 21/67 (2006.01)
CPC H05K 13/087 (2018.08) [H01L 21/67276 (2013.01); H01L 21/67294 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A non-transitory computer-readable medium comprising instructions that, when executed by a processor of a processing system, cause the processing system to perform a method for improving operation of semiconductor processing system, the method comprising:
receiving a tracking data for a part, the tracking data comprising a part identifier;
receiving a status data for the part, the status data comprising a condition of the part;
updating a chamber configuration of a chamber of a semiconductor processing tool, the configuration comprising a listing of a plurality of parts composing the chamber, the chamber configuration comprising the part identifier and condition of the part;
generating an updated condition of the part upon detection of operation of the semiconductor processing tool; and
providing the status data for the part comprising the updated condition.