US 11,856,702 B2
Adapter board, method for manufacturing the same and circuit board assembly using the same
Lixiang Huang, Shenzhen (CN); and Hua Miao, Shenzhen (CN)
Assigned to SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed by SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed on Sep. 1, 2021, as Appl. No. 17/463,575.
Application 17/463,575 is a continuation of application No. PCT/CN2021/103808, filed on Jun. 30, 2021.
Prior Publication US 2023/0007778 A1, Jan. 5, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/186 (2013.01) [H05K 1/144 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An adapter board, comprising:
a board body;
a first component buried in the board body;
a first connector located on a first surface of the board body, and configured to be connected with a circuit board and the first component;
a second connector located on a second surface of the board body opposite to the first side, and configured to be connected with a second component;
a first conductive body buried in the board body, wherein one end of the first conductive body is connected with the first component, and the other end of the first conductive body is connected with the first connector; and
a second conductive body buried in the board body, wherein one end of the second conductive body is connected with the first component, and the other end of the second conductive body is connected with the second connector;
wherein the board body is provided with a receiving room, and the first component is placed in the receiving room;
each of the first conductive body and the second conductive body is a conductive blind hole formed on laminated multilayer sub-boards; and
the board body comprises a first sub-board and a second sub-board laminated directly on the first sub-board, the receiving room is formed in the first sub-board, the conductive blind hole extends through the second sub-board to the first sub-board and comprises a first sub-blind-hole and a second sub-blind-hole, the first sub-blind-hole is formed in the first sub-board and communicated with the receiving room, the second sub-blind-hole is formed in the second sub-board, a side of the first sub-board away from the first component is provided with a first fan-out pad, the first sub-blind-hole is respectively connected with the first fan-out pad and the first component, and the first fan-out pad is configured to be connected with the second sub-blind-hole; and
wherein the board body further comprises a third sub-board laminated on the second sub-board at a side away from the first sub-board, and the conductive blind hole further comprises a third sub-blind-hole extending through the second sub-board to the third sub-board and connected to the second sub-blind-hole; and
a side of the second sub-board away from the first sub-board is provided with a second fan-out pad configured to be connected with the third sub-blind-hole, and at least part of the third sub-blind-hole is formed on the second fan-out pad and exposed on a side of the third sub-board away from the second sub-board.