US 11,856,701 B2
Printed circuit board
Hyun Woo Kwon, Suwon-si (KR); Ki Ran Park, Suwon-si (KR); Kyeong Yub Jung, Suwon-si (KR); Jin Uk Lee, Suwon-si (KR); and Jae Heun Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 16, 2022, as Appl. No. 17/673,405.
Claims priority of application No. 10-2021-0158568 (KR), filed on Nov. 17, 2021.
Prior Publication US 2023/0156922 A1, May 18, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/185 (2013.01) [H05K 1/112 (2013.01); H05K 1/183 (2013.01); H05K 3/4697 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating layer including a first cavity and a second cavity;
a first electronic component disposed in the first cavity and including a first pad disposed in a first direction;
a second electronic component disposed in the second cavity and including a second pad disposed in a second direction opposite to the first direction;
a second insulating layer disposed in the first cavity and covering the first electronic component; and
a third insulating layer disposed in the second cavity and covering the second electronic component,
wherein an upper surface of the second pad is substantially coplanar with an upper surface of the second insulating layer.