US 11,856,698 B2
Circuit board and display device including the same
Jongjin Lee, Yongin-si (KR); Jihun Lee, Seoul (KR); and Hyungchul Choi, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Apr. 12, 2021, as Appl. No. 17/227,551.
Claims priority of application No. 10-2020-0102235 (KR), filed on Aug. 14, 2020.
Prior Publication US 2022/0053643 A1, Feb. 17, 2022
Int. Cl. H05K 1/14 (2006.01); H01L 25/18 (2023.01); G02F 1/1345 (2006.01); H05K 1/18 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); G02F 1/1333 (2006.01); H10K 59/40 (2023.01)
CPC H05K 1/147 (2013.01) [G02F 1/13452 (2013.01); G06F 3/0446 (2019.05); G06F 3/04164 (2019.05); H01L 25/18 (2013.01); H05K 1/181 (2013.01); G02F 1/13338 (2013.01); H05K 2201/057 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); H10K 59/40 (2023.02)] 21 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a first circuit board including first signal lines and second signal lines;
a driving chip coupled to the first circuit board; and
a second circuit board spaced apart from and electrically connected to the driving chip, wherein the second circuit board is a flexible circuit board and wherein at least part of the second circuit board is spaced apart from a first surface of the first circuit board in a bridge structure, each of the first signal lines has different sub-lines that are spaced apart from one another and located on different insulation layers, a portion of a second insulation layer having a smaller size than a first insulation layer to expose a portion of the first insulation layer, the exposed portion of the first insulation layer including a pad area.