US 11,856,687 B2
Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
Sandro Bulovic, Langenzenn (DE)
Assigned to SEMIKRON ELEKTRONIK GMBH & CO. KG, Nuremberg (DE)
Filed by SEMIKRON ELEKTRONIK GMBH & CO. KG, Nuremberg (DE)
Filed on Dec. 21, 2021, as Appl. No. 17/558,341.
Prior Publication US 2023/0200030 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01); H01L 23/495 (2006.01)
CPC H05K 7/20927 (2013.01) [H01L 23/49568 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A power electronics system comprising:
a housing, a cooling device, a power semiconductor module and a capacitor device;
wherein the cooling device has a first main surface and a second main surface;
wherein the power semiconductor module is on the first main surface and is in thermally conducting contact with a first cooling partial surface of the first main surface of the cooling device;
wherein the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device;
wherein a DC connection device is connected to a DC module connection of the power semiconductor module and further comprises at least a first cooling section, in a thermally conducting contact with a second cooling partial surface as part of the first main surface of the cooling device;
wherein the cooling device has at least a first and a second cooling chamber that are each respective liquid cooling chambers for being traversed by a cooling liquid and are each associated with respectively the first and the second cooling partial surfaces;
an AC connection device is connected to an AC module connection of the power semiconductor module and has a second cooling section, which is in thermally conducting contact with the cooling device;
a capacitor connection device of the capacitor device has a third cooling section; and
the third cooling section is in thermally conducting contact with the cooling device.