US 11,856,680 B2
System for processing substrate
Sun Whan Kim, Gyeonggi-do (KR); and Byung Du Jeon, Chungcheongnam-do (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Apr. 29, 2021, as Appl. No. 17/243,954.
Claims priority of application No. 10-2020-0056971 (KR), filed on May 13, 2020.
Prior Publication US 2021/0360767 A1, Nov. 18, 2021
Int. Cl. H05F 3/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01)
CPC H05F 3/02 (2013.01) [B08B 3/02 (2013.01); B08B 13/00 (2013.01); H01L 21/67051 (2013.01); H01L 21/68764 (2013.01); H01L 21/67023 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for processing a substrate comprising:
a first ground bar connected to a building ground; and
a second ground bar connected to a building ground and physically separated from the first ground bar,
wherein the first ground bar and the second ground bar are arranged separately from each other in an electrical box,
wherein the first ground bar is connected to a first electrical component to set a ground level of the first electrical component,
wherein the second ground bar is dedicated to a charged component, and the second ground bar is connected to a first charged component to set a path of an electrostatic discharge current generated by the first charged component.