US 11,856,655 B2
Substrate processing apparatus and substrate processing method
Hirofumi Yamaguchi, Nirasaki (JP); Yoshiaki Sasaki, Nirasaki (JP); Yuichi Nishimori, Nirasaki (JP); and Atsushi Tanaka, Nirasaki (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Apr. 23, 2020, as Appl. No. 16/856,626.
Claims priority of application No. 2019-084002 (JP), filed on Apr. 25, 2019.
Prior Publication US 2020/0344850 A1, Oct. 29, 2020
Int. Cl. H05B 1/02 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H05B 3/28 (2006.01)
CPC H05B 1/0233 (2013.01) [H01L 21/6719 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67161 (2013.01); H01L 21/67167 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); H01L 21/67248 (2013.01); H01L 21/67706 (2013.01); H01L 21/67754 (2013.01); H01L 21/67781 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H05B 3/283 (2013.01); H01L 21/67742 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a chamber having a container including at least one substrate-heating region and at least one substrate-cooling region;
a heating mechanism configured to heat a first substrate in the at least one substrate-heating region;
a cooling mechanism configured to cool a second substrate in the at least one substrate-cooling region while the first substrate is being heated;
a partition provided in the container and configured to separate the at least one substrate-heating region and the at least one substrate-cooling region from each other in terms of heat and pressure;
a sealer provided in the at least one substrate-cooling region and configured to seal a substrate when cooling the substrate; and
a transfer mechanism configured to transfer the substrate between the at least one substrate-heating region and the at least one substrate-cooling region,
wherein the sealer includes a first movable member and a second movable member, and
wherein the first movable member and the second movable member are configured to approach each other when the substrate is cooled by the cooling mechanism so as to seal the substrate, and are configured to be separated from each other when the substrate is transferred by the transfer mechanism so as to release the seal.